ligitek electronics co.,ltd. property of ligitek only lead-free parts pb LE5140-PF rectangle type led lamps data sheet doc. no : qw0905-LE5140-PF rev. : a date : 03 - apr. - 2006
page 1/5 ligitek electronics co.,ltd. property of ligitek only 2.0 5.0 2.8 0.5 typ 1.5max 0.7 7.0 part no. LE5140-PF package dimensions + - 2.54typ 1.0min 60 0 30 -30 100% 0 25%50% 25% 75%50% 75% directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 100% -60 25.0min
page 2/5 ligitek electronics co.,ltd. property of ligitek only unit ratings e symbol parameter absolute maximum ratings at ta=25 mw ma 120 100 a 10 -40 ~ +85 i fp pd peak forward current duty 1/10@10khz power dissipation ir t opr operating temperature reverse current @5v ma 30 i f forward current luminous intensity @10ma(mcd) forward voltage @20ma(v) spectral halfwidth nm color part nomaterial typical electrical & optical characteristics (ta=25 ) min. typ. 8.0138 3.0 max. min. 2.6 451.7 635 lens emitted orange orange diffused gaasp/gap LE5140-PF note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. peak wave length pnm viewing angle 2 1/2 (deg) storage temperature tstg -40 ~ +100 LE5140-PF part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 550 600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 700750 e chip page 3/5 LE5140-PF part no.
ligitek electronics co.,ltd. property of ligitek only page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) 260 c3sec max 260 temp( c) 150 time(sec) 100 120 50 0 0 preheat 2 /sec max 25 60 seconds max 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) LE5140-PF part no.
page 5/5 description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 reliability test: test condition test item operating life test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 thermal shock test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs the purpose of this test is the resistance of the device under tropical for hours. mil-std-202:103b jis c 7021: b-11 LE5140-PF part no.
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